| Name | Wafer | PCB | Loading | Date | Location | Status | Comment |
|---|---|---|---|---|---|---|---|
| ap1b02w10s06 (was ATLAPix1_GradeA_16) | W10 | aH18 v1.05 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, ATLASPIx80OhmthinLowerSimpleISO ATLASPIx80OhmthinLowerSimple ATLASPIx80OhmthinLowerTrigger ATLASPIx80OhmthinUpperSimple ATLASPIx80OhmthinUpperSimpleISO ATLASPIx80OhmthinUpperTrigger
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| ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, ATLASPIx200OhmthinLowerSimpleISO ATLASPIx200OhmthinLowerSimple ATLASPIx200OhmthinLowerTrigger] ATLASPIx200OhmthinUpperSimple] ATLASPIx200OhmthinUpperSimpleISO] ATLASPIx200OhmthinUpperTrigger]
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| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | 1-1-015, CERN | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um. | |
| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). Disposed | |
| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | Was at DESY (Feb'2019), taken back to CERN, but cannot be found anymore | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um | |
| ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 100 um, used by CLICdp | |
| ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Analog OK, No digital activity, thinned to 62 um | |
| ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um | |
| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | Fermilab | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um | |
| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um, Later Trigger and SimpleISO matrices bond ripped off, simple used at DESY | |
| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, leakage current ~3um for -5V to -60V, BUSY_ASSERTED all the time, thinned to 100 um | |
| ap1b02w07s11 | W07 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 80 Ω.cm, wire-bonding done on simple matrix, bad, Digital not functional, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND | |
| ap1b02w06s14 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND | |
| ap1b02w06s11 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND | |
| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND, used at SPS and DESY | |
| ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg | |
| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY | |
| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY, damaged after testbeam? | |
| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg | |
| ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg | |
| ap1b02w23s20 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, bad, digital not functional, probably bad SR, thinned to ~100 um by Heidelberg | |
| ap1b02w23s16 | W23 | aH18 v3.2 (only sample on this board version!) | board CERN, loading UNIGE | 2021/01 | 1-1-015, CERN | Conductive epoxy gluing at CERN bonding lab, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, thinned to ~100 um by Heidelberg, IV: ok, configuration: ok, noise: ok, source (Fe-55): ok |
Diced Thin ATLASPix1 chips received from Heidelberg
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18 Chips Received from Wafer 09. Substrate resistivity is ~80 Ω.cm.
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13 Chips Received from Wafer 10. Substrate resistivity is ~80 Ω.cm. All have used already.
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10 more Chips Received from Wafer 10. Substrate resistivity is ~80 Ω.cm.
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14 Chips Received from Wafer 11. Substrate resistivity is ~80 Ω.cm.
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17 Chips Received from Wafer 22. Substrate resistivity is ~200 Ω.cm.
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13 Chips Received from Wafer 23. Substrate resistivity is ~200 Ω.cm.
All the chips from the above box are used already!
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Wafer 06 is fully processed with DBG dicing and thinning process. Substrate resistivity is ~20 Ω.cm.
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Wafer 07 is fully processed with DBG dicing and thinning process. Substrate resistivity is ~80 Ω.cm.
Update on remaining samples+boards (January 2021)
- 12 remaining (fully assembled) PCBs v3.2 have been collected from DMS and are now in lab 1-01-015
- all remaining bare samples have also been collected and are in the dry storage in lab 1-01-015
- one sample from w23 has been bonded to a PCB v3.2 in the bond lab at CERN on January 7, 2021. First test look successful. This is the only sensor on a PCB v3.2.
- The table above with information about all samples has been updated in December 2020 by Jens Kroeger
