ATLASPix1/Batch-2-samples.md

@@ -9,16 +9,16 @@
 | ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN  |  :x:  | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Analog OK, No digital activity, thinned to 62 um 
 | ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :white\_check\_mark:   | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um 
 | ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | Fermilab  |  :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um 
-| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN  |  :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um, Later Trigger and SimpleISO matrices bond ripped off
+| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN  |  :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um, Later Trigger and SimpleISO matrices bond ripped off, simple used at DESY
 | ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN  |  :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, leakage current ~3um for -5V to -60V, BUSY_ASSERTED all the time, thinned to 100 um 
 | ap1b02w07s11 | W07 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 80 Ω.cm, wire-bonding done on simple matrix, bad, Digital not functional, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND 
 | ap1b02w06s14 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND 
 | ap1b02w06s11 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND 
-| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND 
+| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND, used at SPS and DESY
 | ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg 
-| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg 
-| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :white\_check\_mark:  | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg 
-| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg
+| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY
+| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :white\_check\_mark:  | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY
+| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg
 | ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN  | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
 | ap1b02w23s20 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN  | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, bad, digital not functional, probably bad SR, thinned to ~100 um by Heidelberg