ATLASPix1/Batch-2-samples.md

@@ -50,3 +50,13 @@ All the chips from the above box are used already!
 
 * Wafer 07 is fully processed with DBG dicing and thinning process. Substrate resistivity is ~80 Ω.cm.
 ![P_20181108_100433](uploads/012cdb45dd92c9bc82113185d100e9aa/P_20181108_100433.jpg)
+
+# Update on remaining samples+boards (January 2021)
+
+* 12 remaining (fully assembled) PCBs v3.2 have been collected from DMS and are now in lab 1-01-015
+* all remaining bare samples have also been collected and are in the dry storage in lab 1-01-015
+* one sample from w23 has been bonded to a PCB v3.2 in the bond lab at CERN on January 7, 2021. First test look successful. This is the only sensor on a PCB v3.2. 
+* The table above with information about all samples has been updated in December 2020 by Jens Kroeger
+
+![ATLASpix_W23_Box2](uploads/287800eba1e8795edd3d1892ab533652/ATLASpix_W23_Box2.png)
+![ATLASpix_allSamplesLeft](uploads/0198ad01601a724a549b523260e80d45/ATLASpix_allSamplesLeft.JPG)
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