ATLASPix1/Batch-2-samples.md

@@ -4,7 +4,7 @@
 | ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :question: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx200OhmthinLowerSimpleISO`![ATLASPIx200OhmthinLowerSimpleISO](/uploads/5d71e81d226388e5ff633326e08cc00e/ATLASPIx200OhmthinLowerSimpleISO.bmp)<br/>`ATLASPIx200OhmthinLowerSimple`![ATLASPIx200OhmthinLowerSimple](/uploads/72103e3b32be64994e5235174f2405e1/ATLASPIx200OhmthinLowerSimple.bmp)<br/>`ATLASPIx200OhmthinLowerTrigger]`![ATLASPIx200OhmthinLowerTrigger](/uploads/54d9932b01cdd4ce1d06882cb583ab10/ATLASPIx200OhmthinLowerTrigger.bmp)<br/>`ATLASPIx200OhmthinUpperSimple]`![ATLASPIx200OhmthinUpperSimple](/uploads/235ef1bbc6d55ac9053ebc358842a35f/ATLASPIx200OhmthinUpperSimple.bmp)<br/>`ATLASPIx200OhmthinUpperSimpleISO]`![ATLASPIx200OhmthinUpperSimpleISO](/uploads/c3538a9063fce9bb872eb5e864f61185/ATLASPIx200OhmthinUpperSimpleISO.bmp)<br/>`ATLASPIx200OhmthinUpperTrigger]`![ATLASPIx200OhmthinUpperTrigger](/uploads/32b997a1a00d64dba62db73a14cdc12b/ATLASPIx200OhmthinUpperTrigger.bmp) |
 | ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | 1-1-015, CERN  | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
 | ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN |  :x: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). **Disposed** 
-| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | NA - H6B testbeam, CERN |  :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um 
+| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | Was at DESY (Feb'2019), taken back to CERN, but cannot be found anymore |  :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um 
 | ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE |  :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 100 um, used by CLICdp 
 | ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 1-1-015, CERN  |  :x:  | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Analog OK, No digital activity, thinned to 62 um 
 | ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :white\_check\_mark:   | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um