Skip to content

Changes

Page history
Update Batch 2 samples authored by Jens Kroeger's avatar Jens Kroeger
Hide whitespace changes
Inline Side-by-side
ATLASPix1/Batch-2-samples.md
View page @ 1c6ca9ba
...@@ -17,7 +17,7 @@ ...@@ -17,7 +17,7 @@
| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND, used at SPS and DESY | ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND, used at SPS and DESY
| ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg | ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY | ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY
| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY | ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg, simple used at DESY, damaged after testbeam?
| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg | ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg
| ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg | ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s20 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, bad, digital not functional, probably bad SR, thinned to ~100 um by Heidelberg | ap1b02w23s20 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, bad, digital not functional, probably bad SR, thinned to ~100 um by Heidelberg
... ...
......