ATLASPix1/Batch-2-samples.md

@@ -6,11 +6,11 @@
 | ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN |  :x: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). **Disposed** 
 | ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | NA - H6B testbeam, CERN |  :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um 
 | ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE |  :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 100 um 
-| ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | UniGE |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
-| ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | UniGE |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
-| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | UniGE |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
-| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | UniGE |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um 
-| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | UniGE |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um 
+| ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
+| ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
+| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um 
+| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um 
+| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN  |  :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um 
 
 
 # Diced Thin ATLASPix1 chips received from Heidelberg