| ... | @@ -33,4 +33,10 @@ |
... | @@ -33,4 +33,10 @@ |
|
|
* 13 Chips Received from Wafer 23. Substrate resistivity is ~200 Ω.cm.
|
|
* 13 Chips Received from Wafer 23. Substrate resistivity is ~200 Ω.cm.
|
|
|

|
|

|
|
|
All the chips from the above box are used already!
|
|
All the chips from the above box are used already!
|
|
|
 |
|

|
|
\ No newline at end of file |
|
|
|
|
|
* Wafer 06 is fully processed with DBG dicing and thinning process. Substrate resistivity is ~20 Ω.cm.
|
|
|
|

|
|
|
|
|
|
|
|
* Wafer 07 is fully processed with DBG dicing and thinning process. Substrate resistivity is ~80 Ω.cm.
|
|
|
|
 |