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| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg
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| ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
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| ap1b02w23s20 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, bad, digital not functional, probably bad SR, thinned to ~100 um by Heidelberg
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| ap1b02w23s16 | W23 | aH18 v3.2 | board CERN, loading UNIGE | 2021/01 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing at CERN bonding lab, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, thinned to ~100 um by Heidelberg, IV: ok, configuration: ok, noise: ok
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# Diced Thin ATLASPix1 chips received from Heidelberg
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