| ... | @@ -4,7 +4,8 @@ |
... | @@ -4,7 +4,8 @@ |
|
|
| ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :question: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx200OhmthinLowerSimpleISO`<br/>`ATLASPIx200OhmthinLowerSimple`<br/>`ATLASPIx200OhmthinLowerTrigger]`<br/>`ATLASPIx200OhmthinUpperSimple]`<br/>`ATLASPIx200OhmthinUpperSimpleISO]`<br/>`ATLASPIx200OhmthinUpperTrigger]` |
|
|
| ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :question: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx200OhmthinLowerSimpleISO`<br/>`ATLASPIx200OhmthinLowerSimple`<br/>`ATLASPIx200OhmthinLowerTrigger]`<br/>`ATLASPIx200OhmthinUpperSimple]`<br/>`ATLASPIx200OhmthinUpperSimpleISO]`<br/>`ATLASPIx200OhmthinUpperTrigger]` |
|
|
|
| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | Tomas Vanat Office | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
|
|
| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | Tomas Vanat Office | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
|
|
|
| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). **Disposed**
|
|
| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). **Disposed**
|
|
|
| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 200 um
|
|
| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um
|
|
|
|
| ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE | :question: | Conductive epoxy gluing in Unige, wire-bonding to be done on Simple matrix only, still to be tested, thinned to 100 um
|
|
|
|
|
|
|
|
# Diced Thin ATLASPix1 chips received from Heidelberg
|
|
# Diced Thin ATLASPix1 chips received from Heidelberg
|
|
|
|
|
|
| ... | |
... | |
| ... | | ... | |