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Update Batch 2 samples authored by Tomas Vanat's avatar Tomas Vanat
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ATLASPix1/Batch-2-samples.md
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| ap1b02w10s06 (was ATLAPix1_GradeA_16) | W10 | aH18 v1.05 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx80OhmthinLowerSimpleISO`![ATLASPIx80OhmthinLowerSimpleISO](/uploads/a3cafeee6e49e0cb550369e1f09ecd34/ATLASPIx80OhmthinLowerSimpleISO.bmp)<br/>`ATLASPIx80OhmthinLowerSimple`![ATLASPIx80OhmthinLowerSimple](/uploads/9733d1678bcd70ac9763c6879dccdaec/ATLASPIx80OhmthinLowerSimple.bmp)<br/>`ATLASPIx80OhmthinLowerTrigger`![ATLASPIx80OhmthinLowerTrigger](/uploads/baf2bb222e833ce9ec85790c8c8eb3a3/ATLASPIx80OhmthinLowerTrigger.bmp)<br/>`ATLASPIx80OhmthinUpperSimple`![ATLASPIx80OhmthinUpperSimple](/uploads/4e10fc5a83d77373fc11311d60454699/ATLASPIx80OhmthinUpperSimple.bmp)<br/>`ATLASPIx80OhmthinUpperSimpleISO`![ATLASPIx80OhmthinUpperSimpleISO](/uploads/71fd3e7ede6c955459e3e71c333e9853/ATLASPIx80OhmthinUpperSimpleISO.bmp)<br/>`ATLASPIx80OhmthinUpperTrigger`![ATLASPIx80OhmthinUpperTrigger](/uploads/7c36efde2c1d0caf252f93dd02050bcc/ATLASPIx80OhmthinUpperTrigger.bmp) |
| ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :question: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx200OhmthinLowerSimpleISO`![ATLASPIx200OhmthinLowerSimpleISO](/uploads/5d71e81d226388e5ff633326e08cc00e/ATLASPIx200OhmthinLowerSimpleISO.bmp)<br/>`ATLASPIx200OhmthinLowerSimple`![ATLASPIx200OhmthinLowerSimple](/uploads/72103e3b32be64994e5235174f2405e1/ATLASPIx200OhmthinLowerSimple.bmp)<br/>`ATLASPIx200OhmthinLowerTrigger]`![ATLASPIx200OhmthinLowerTrigger](/uploads/54d9932b01cdd4ce1d06882cb583ab10/ATLASPIx200OhmthinLowerTrigger.bmp)<br/>`ATLASPIx200OhmthinUpperSimple]`![ATLASPIx200OhmthinUpperSimple](/uploads/235ef1bbc6d55ac9053ebc358842a35f/ATLASPIx200OhmthinUpperSimple.bmp)<br/>`ATLASPIx200OhmthinUpperSimpleISO]`![ATLASPIx200OhmthinUpperSimpleISO](/uploads/c3538a9063fce9bb872eb5e864f61185/ATLASPIx200OhmthinUpperSimpleISO.bmp)<br/>`ATLASPIx200OhmthinUpperTrigger]`![ATLASPIx200OhmthinUpperTrigger](/uploads/32b997a1a00d64dba62db73a14cdc12b/ATLASPIx200OhmthinUpperTrigger.bmp) |
| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | Tomas Vanat Office | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | 1-1-015, CERN | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, tested, thinned to 70 um. VSSA seemed not connected (production issue of W11 perhaps). **Disposed**
| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | NA - H6B testbeam, CERN | :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 100 um
| ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE | :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 100 um, used by CLICdp
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| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | Fermilab | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um
| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um, Later Trigger and SimpleISO matrices bond ripped off
| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um
| ap1b02w07s11 | W07 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 80 Ω.cm, wire-bonding done on simple matrix, bad, Digital not functional, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s14 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w07s11 | W07 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 80 Ω.cm, wire-bonding done on simple matrix, bad, Digital not functional, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s14 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s11 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 1-1-015, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix,tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Tested,OK, thinned to ~100 um by Heidelberg
| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, Problem with TS and shift register, thinned to ~100 um by Heidelberg
| ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, tested,OK, thinned to ~100 um by Heidelberg
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