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| ap1b02w23s12 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | UniGE | :white_check_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 100 um, used by CLICdp
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| ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um
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| ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um
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| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, still to be tested, thinned to 62 um
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| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um
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| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um
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| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um
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