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| ap1b02w10s06 (was ATLAPix1_GradeA_16) | W10 | aH18 v1.05 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx80OhmthinLowerSimpleISO`<br/>`ATLASPIx80OhmthinLowerSimple`<br/>`ATLASPIx80OhmthinLowerTrigger`<br/>`ATLASPIx80OhmthinUpperSimple`<br/>`ATLASPIx80OhmthinUpperSimpleISO`<br/>`ATLASPIx80OhmthinUpperTrigger` |
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| ap1b02w23s10 (was ATLAPix1_GradeA_17) | W23 | aH18 v1.0 | board CERN, loading UNIGE | 2018/06 | CERN-887-R-Q58 (NA ctrl room) | :question: | Non-conductive sticky tape gluing in Unige, wire-bonding looked poor overall, see captured images. M2 and SimpleISO wire-bonds are removed, Simple is working fine now, `ATLASPIx200OhmthinLowerSimpleISO`<br/>`ATLASPIx200OhmthinLowerSimple`<br/>`ATLASPIx200OhmthinLowerTrigger]`<br/>`ATLASPIx200OhmthinUpperSimple]`<br/>`ATLASPIx200OhmthinUpperSimpleISO]`<br/>`ATLASPIx200OhmthinUpperTrigger]` |
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| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | Tomas Vanat Office | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 \muem
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| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested
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| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested
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| ap1b02w10s13 | W10 | aH18 v2.0 | board CERN, loading UNIGE | 2018/06 | Tomas Vanat Office | :white_check_mark: | Non-conductive sticky tape gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um.
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| ap1b02w11s05 | W11 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 70 um
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| ap1b02w23s15 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/08 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding on Simple matrix only, bonding looks ok, still to be tested, thinned to 200 um
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# Diced Thin ATLASPix1 chips received from Heidelberg
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