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Update Batch 2 samples authored by D M S Sultan's avatar D M S Sultan
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| ap1b02w10s33 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Analog OK, No digital activity, thinned to 62 um
| ap1b02w10s32 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um
| ap1b02w10s31 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | Fermilab | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on Simple matrix only, Functional, thinned to 62 um
| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um
| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um
| ap1b02w10s30 | W10 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 62 um, Later Trigger and SimpleISO matrices bond ripped off
| ap1b02w23s09 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/10 | 161-01-006, CERN | :white\_check\_mark: | Conductive epoxy gluing in Unige, wire-bonding done on all three matrices, still to be tested, thinned to 100 um
| ap1b02w07s11 | W07 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 80 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s14 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s11 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w06s12 | W06 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by OPTIM (~90 um at Silicon only), Die dimension is bit large, Placement has engineered with Kapton tape to isolate HV to GND
| ap1b02w23s13 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by Heidelberg
| ap1b02w23s11 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by Heidelberg
| ap1b02w23s22 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by Heidelberg
| ap1b02w23s23 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by Heidelberg
| ap1b02w23s21 | W23 | aH18 v3.1 | board CERN, loading UNIGE | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 200 Ω.cm, wire-bonding done on simple matrix, still to be tested, thinned to ~100 um by Heidelberg
# Diced Thin ATLASPix1 chips received from Heidelberg
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