List of batch 2 production wafers
Eight unprocessed wafers W05, W06, W07, W13, W17, W18, W19, W20 were received at UNIGE on 2018-06-04. W05, W07 was transferred to HD on 2018-06-20. Wafers W09, W10, W22, W23 were thinned and diced and then send to HD with some samples being transferred to UNIGE afterward.
| Name | Marker topside | Marker backside | Nominal resitivity (Ohm.cm) | Location | Status |
|---|---|---|---|---|---|
| W05 | E72558W05PG4 | 6D710186KE1624B0A4 | std | Heidelberg | untested |
| W06 | E72558W06PB4 | 6D710371KE1624B0H1 | std | UNIGE | tested, diced and thinned to 100µm |
| W07 | E72558W07PD7 | 0G501025KE5010B0D6 | 50-100 | UNIGE | tested, diced and thinned to 100µm |
| W09 | 50-100 | ? dies at Heidelberg, 18 dies at UNIGE | thinned to 70µm, diced | ||
| W10 | 50-100 | ? dies at Heidelberg, 13 dies at UNIGE | thinned to 70µm, diced, 8 of them given back to Heidelberg for as irradiation candidates | ||
| W11 | 50-100 | ? dies at Heidelberg, 14 dies at UNIGE | thinned to 70µm, diced | ||
| W13 | E72558W13PG0 | 0G501105KE2003B0A6 | 1000 (according to Ivan) | UNIGE | untested, has sent to Heidelberg Oct 22 2019 |
| W14 | -- | -- | 200-400 | Not Produced | |
| W17 | E72558W17PA6 | 0G501026KE2003B0D6 | 1000 (according to Ivan) | UNIGE | untested, has sent to Heidelberg Feb 12 2020 |
| W18 | E72558W18PD1 | 0G501136KE2003B0H0 | 1000 (according to Ivan) | Heidelberg | untested |
| W19 | E72558W19PF4 | 0G501051KE2002B0B1 | 200-400 | UNIGE | untested, sent to Heidelberg Feb 2019 |
| W20 | E72558W20PD1 | 0G501118KE2003B0D4 | 200-400 | UNIGE | untested |
| W22 | 200-400 | ? dies at Heidelberg, 17 dies at UNIGE | thinned to 100µm, diced | ||
| W23 | 200-400 | ? dies at Heidelberg, 23 dies at UNIGE | thinned to 100µm, diced, 8 of them given back to Heidelberg for as irradiation candidates |
