| ... | ... | @@ -6,7 +6,7 @@ Eight unprocessed wafers W05, W06, W07, W13, W17, W18, W19, W20 were received at |
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| W05 | E72558W05PG4 | 6D710186KE1624B0A4 | std | Heidelberg | untested |
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| W06 | E72558W06PB4 | 6D710371KE1624B0H1 | std | UNIGE | tested, diced and thinned to 100µm |
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| W07 | E72558W07PD7 | 0G501025KE5010B0D6 | 50-100 | UNIGE | untested, diced and thinned to 100µm |
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| W07 | E72558W07PD7 | 0G501025KE5010B0D6 | 50-100 | UNIGE | tested, diced and thinned to 100µm |
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| W09 | | | 50-100 | ? dies at Heidelberg, 18 dies at UNIGE | thinned to 70µm, diced | |
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| W10 | | | 50-100 | ? dies at Heidelberg, 13 dies at UNIGE | thinned to 70µm, diced, 8 of them given back to Heidelberg for as irradiation candidates | |
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| W11 | | | 50-100 | ? dies at Heidelberg, 14 dies at UNIGE | thinned to 70µm, diced | |
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