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ATLASPix2 samples

Last edited by Dms Sultan
Name Wafer Process Foundry Dicing Foundry PCB Loading Date Location Status Comment
ap2amss05 ❓ AMS Fraunhofer AP2 v1.0 board UniGe, loading UniGe 2018/11 161-01-006, CERN ❌ Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~220 um. There was bug in PCB.
ap2tsis01 ❓ TSI Fraunhofer AP2 v1.0 board UniGe, loading UniGe 2018/11 161-01-006, CERN ❌ Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~254 um. There was bug in PCB.
ap2tsis02 ❓ TSI Fraunhofer AP2 v2.0 board UniGe, loading UniGe 2019/01 161-01-006, CERN ❓ Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~254 um
ap2amss06 ❓ AMS Fraunhofer AP2 v2.0 board UniGe, loading UniGe 2019/01 161-01-006, CERN ❓ Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~220 um
  • Here, 'ap2amss05' elaborates as: ap2 "ATLASPix2", ams "AMS Foundry fabricated" and s05 "Sample 05". For TSI fabricated sample, it is written as 'tsi' instead 'ams'.

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