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Update ATLASPix2 samples authored by D M S Sultan's avatar D M S Sultan
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| Name | Wafer | Process Foundry | Dicing Foundry| PCB | Loading | Date | Location | Status | Comment |
| ---- | ----- | --------------- | ------------- | --- | ------- | ---- | -------- | ------ | ------- |
| ap2amss05 | :question: | AMS | Fraunhofer | AP2 v1.0 | board UniGe, loading UniGe | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~220 um
| ap2tsis01 | :question: | TSI | Fraunhofer | AP2 v1.0 | board UniGe, loading UniGe | 2018/11 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~254 um
| ap2amss05 | :question: | AMS | Fraunhofer | AP2 v1.0 | board UniGe, loading UniGe | 2018/11 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~220 um. There was bug in PCB.
| ap2tsis01 | :question: | TSI | Fraunhofer | AP2 v1.0 | board UniGe, loading UniGe | 2018/11 | 161-01-006, CERN | :x: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~254 um. There was bug in PCB.
| ap2tsis02 | :question: | TSI | Fraunhofer | AP2 v2.0 | board UniGe, loading UniGe | 2019/01 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~254 um
| ap2amss06 | :question: | AMS | Fraunhofer | AP2 v2.0 | board UniGe, loading UniGe | 2019/01 | 161-01-006, CERN | :question: | Conductive epoxy gluing in Unige, Substrate resistivity 20 Ω.cm, wire-bonding done on Pixel Matrix and Pixel Memory Array, yet to be tested, thinned to ~220 um
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