TPS7A49 (IC2, IC3, IC6) layout could be improved
Datasheet shows example layout where e.g. ground plane connected to the thermal pad is much larger allowing for better heat dissipation.
Datasheet shows example layout where e.g. ground plane connected to the thermal pad is much larger allowing for better heat dissipation.
changed title from TPS7A49 (IC2, IC3) layout could be improved to TPS7A49 (IC2, IC3, IC6) layout could be improved
By Grzegorz Daniluk on 2021-12-13T12:48:01 (imported from GitLab)
Done by Jeremy; proper polygons created according to TI recommendation
By Evangelia Gousiou on 2022-01-10T17:24:05 (imported from GitLab)
closed
By Evangelia Gousiou on 2022-01-10T17:24:14 (imported from GitLab)