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New conditions of UT FE simulation + TypeB sensor thickness correction

Hangyi Wu requested to merge upgrade/ut-front-end-tuning into upgrade/master

Work with lhcb/Boole!584 (merged) (+ many other MRs), and SIMCOND!253

This MR contains the following changes:

  • Fix of the thickness of Type B sensor. Specifically Type B sensor thickness was lower than specs and changed from 250 to 320 microns.
    • This corrects the ADC distribution of UT clusters from Type B sensors
    • This adds very little to the material budgets because the material is silicon
  • Connect sectors to new conditions introduced by following SIMCOND MRs (to be made)
Edited by Hangyi Wu

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