Updated MP materials

updates to passive material: removes enclosure box, cooling materials. Sheet thickness = 5.5mm is reflective of the below changes to materials. Then, simply lots of new materials defined as needed for future components.

Fractions are updated assuming:

• Uniform sheet of PCB materials for HDI+Epoxy+DCDC
• 2* 2mm thick carbon foam core, across full module area
• 2* 150um thick carbon fiber facings, across full module
• 530um thick flex across full module (flex material includes epoxy)

  <material name="MP:PassiveMaterial" >
    <D type="density" value="0.708" unit="g/cm3"/>
    <fraction n="0.119" ref="MP:PCB"/> <!-- HDI boards, uniformly distributed (also DCDC uniformly distributed) -->
    <fraction n="0.097" ref="MP:FlexCable"/>
    <fraction n="0.055" ref="MP:CarbonFiber"/>
    <fraction n="0.727" ref="MP:CarbonFoam"/>
    <fraction n="0.002" ref="MP:Epoxy"/>
  </material>

Then, simply lots of new materials defined as needed for future components.