Bump connectivity scans
This MR adds and improves some things related to source testing and scanning bump failures.
- Add bump failure scans:
- A merged bumps scan based on detection of high crosstalk
- Three different disconnected bumps scans:
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- Crosstalk-based (fast: 8min + 1min [tuning + scan])
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- Based on threshold shift upon sensor bias change (slower: 5min + 12min [tuning + scan])
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- Modified source scan (need source, rather slow)
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- Improve other scans:
Detect bad pixels in digital and analog scan- Normal source scan: Add stop condition minimum number of hits per pixel
- Noise occupancy scan: Send much more triggers and properly use statistics for noisy pixel identification
(Add optional HitOr-trigger based noise occupancy scan for special noisy pixels not seen with normal scan)(Return uncertainties from S-curve fitting, add optional argument for passing fit start parameter)
TODO:
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Source-based bump scan: Limit occupancy of noisy pixels and ignore disconnected pixels during estimation of average occupancy per tile -
Add meta scripts -
Cherry-pick changes to S-curve fitting -
Cherry-pick HitOr-trigger based noise occupancy scan -
Perhaps add ToT-histogram fitting routine to (modified) source scan in order to also catch disconnected pixels that are very noisy?
NOTES:
Estimated errors* of bump disconnection scans are:
- [25x100]:
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Crosstalk:
N_{disconnected}^{real} \simeq N_{measured}\!\,^{+6 \pm 5}_{-11 \pm 10} = N_{measured}\!\,^{+0.008\% \pm 0.007\%}_{-0.01\% \pm 0.01\%}
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Threshold:
N_{disconnected}^{real} \simeq N_{measured}\!\,^{+3 \pm 2}_{-5 \pm 1} = N_{measured}\!\,^{+0.004\% \pm 0.003\%}_{-0.007\% \pm 0.001\%}
- [50x50]:
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Crosstalk:
N_{disconnected}^{real} \simeq N_{measured}\!\,^{+2 \pm 1}_{-42 \pm 1} = N_{measured}\!\,^{+0.003\% \pm 0.001\%}_{-0.05\% \pm 0.001\%}
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Threshold:
N_{disconnected}^{real} \simeq N_{measured}\!\,^{+1 \pm 1}_{-16 \pm 11} = N_{measured}\!\,^{+0.001\% \pm 0.001\%}_{-0.02\% \pm 0.01\%}
*) (+)-error means average not recognized disconnected bumps, (-)-error means average not recognized connected bumps
Test results with skewed bump bonding [25umx100um sensor] (bump bond connection maps):
Discrepancies:
Connected with crosstalk, disconnected with source:
Disconnected with crosstalk, connected with source:
Connected with threshold, disconnected with source:
Disconnected with threshold, connected with source:
Simulation: